| AI |
Artificial Intelligence |
Drives explosive demand for compute + networking |
| ASIC |
Application-Specific Integrated Circuit |
Custom AI chips used by hyperscalers |
| ASP |
Average Selling Price |
Higher speeds (1.6T/3.2T) increase ASPs |
| BoM |
Bill of Materials |
Key for margin analysis |
| CPO |
Co-Packaged Optics |
Next-gen optical architecture integrating optics near switch/GPU |
| NPO |
Near-Packaged Optics / Onboard Optics |
Intermediate step between pluggables and CPO |
| SiPh |
Silicon Photonics |
Optical technology expected to gain major market share |
| EML |
Electro-Absorption Modulated Laser |
Traditional optical laser technology |
| CW Laser |
Continuous Wave Laser |
Common light source for silicon photonics |
| VCSEL |
Vertical-Cavity Surface-Emitting Laser |
Short-range optical laser technology |
| FAU |
Fiber Array Unit |
Connects optical engines to fiber |
| ELS |
External Laser Source |
Supplies laser light to CPO systems |
| DSP |
Digital Signal Processor |
Signal conditioning inside optical modules |
| PIC |
Photonic Integrated Circuit |
Integrates optical functions onto chips |
| EIC |
Electronic Integrated Circuit |
Traditional electronic chip circuitry |
| GPU |
Graphics Processing Unit |
Main AI accelerator |
| XPU |
General term for AI accelerators |
Includes GPUs, CPUs, NPUs, ASICs |
| CPU |
Central Processing Unit |
General-purpose compute |
| NPU |
Neural Processing Unit |
AI-focused processor |
| NIC |
Network Interface Card |
Connects servers to network fabric |
| NVL72 / NVL144 / NVL576 |
Nvidia rack-scale GPU architectures |
Defines cluster scale and networking complexity |
| NVSwitch |
Nvidia high-speed GPU interconnect switch |
Enables GPU-to-GPU communication |
| ToR |
Top-of-Rack Switch |
Primary networking switch inside racks |
| EoR |
End-of-Row Switch |
Aggregates rack networking |
| InfiniBand |
Nvidia low-latency networking protocol |
Dominant in AI training clusters |
| Ethernet |
Standard networking protocol |
Increasingly used for AI networking |
| AEC |
Active Electrical Cable |
Copper cable with retimers for longer distances |
| ACC |
Active Copper Cable |
Copper cable with redrivers |
| DAC |
Direct Attach Copper |
Simple low-cost short-distance copper cable |
| AOC |
Active Optical Cable |
Optical cable with integrated transceivers |
| MPO |
Multi-Fiber Push-On connector |
High-density fiber connector |
| PCB |
Printed Circuit Board |
Used for electrical interconnects |
| PCB Midplane |
Large internal PCB connection architecture |
New scale-up design in Rubin Ultra |
| CCL |
Copper Clad Laminate |
Material used in advanced PCBs |
| TAM |
Total Addressable Market |
Core valuation framework |
| TCO |
Total Cost of Ownership |
Important for hyperscaler adoption decisions |
| Tb/s |
Terabits per second |
Measures networking bandwidth |
| Gb/s |
Gigabits per second |
Lower bandwidth measurement |
| 800G / 1.6T / 3.2T |
Optical networking speeds |
Core upgrade cycle driving AI networking demand |
| Scale-Up |
Expanding compute within a rack/system |
Requires ultra-fast low-latency interconnects |
| Scale-Out |
Connecting racks/clusters together |
Major driver of optical demand |
| Hyperscaler |
Large cloud provider (AWS, Google, Meta, Microsoft) |
Biggest AI infrastructure spenders |
| CSP |
Cloud Service Provider |
Another term for hyperscalers |
| MRM |
Micro Ring Modulator |
Silicon photonics modulation technology |
| MZM |
Mach-Zehnder Modulator |
Alternative optical modulation technology |
| InP |
Indium Phosphide |
Critical semiconductor material for lasers |
| GTC |
Nvidia GPU Technology Conference |
Major roadmap announcement event |
| SerDes |
Serializer/Deserializer |
Converts parallel ↔ serial data for high-speed links |
| DR / FR |
Data center reach optical standards |
Different transmission distance classes |